A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
Imani, Roghayeh; Acharya, Sarthak; Putaala, Jussi; Chouhan, Shailesh; Hagberg, Juha; Myllymäki, Sami; Nousiainen, Olli; Jantunen, Heli; Delsing, Jerker (2023-01-01)
URL:
https://shop.ipc.org/ipc-apex/ipc-apex-conference-presentationproceedings/Revision-2023/englishIPC International
01.01.2023
Imani, R., Acharya, S., Putaala, J., Chouhan, S., Hagberg, J., Myllymäki, S., Nousiainen, O., Jantunen, H. & Delsing, J. (2023). A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards. In IPC APEX EXPO 2023 Technical Conference Proceedings (pp. 810-816). IPC International.
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© IPC APEX EXPO 2023 Technical Conference
https://rightsstatements.org/vocab/InC/1.0/
© IPC APEX EXPO 2023 Technical Conference
https://rightsstatements.org/vocab/InC/1.0/
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:oulu-202401121208
https://urn.fi/URN:NBN:fi:oulu-202401121208
Tiivistelmä
Abstract
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and wearable devices. Therefore, miniaturization of copper lines and spaces (L/S) down to 5/5μm and possibly even lower is needed to add more layers and components without increasing the size, weight, or volume of the PCB. The development of fully additive fabrication techniques that are flexible, precise, uniform, cost-effective, and environmentally friendly is urgently needed for creating next-generation miniaturized HDI PCBs. This study reports a fully additive manufacturing method called sequential build-up-covalent bonded metallization (SBUCBM) for the fabrication of miniaturized copper interconnects. Optical microscopy and scanning electron microscopy (SEM) imaging confirm the formation of robust copper interconnects with a feature size of L/S ≤ 5/5μm. Energy-dispersive x-ray spectroscopy (EDX) analysis demonstrates detailed information about selective copper metallization in the SBU-CBM method.
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and wearable devices. Therefore, miniaturization of copper lines and spaces (L/S) down to 5/5μm and possibly even lower is needed to add more layers and components without increasing the size, weight, or volume of the PCB. The development of fully additive fabrication techniques that are flexible, precise, uniform, cost-effective, and environmentally friendly is urgently needed for creating next-generation miniaturized HDI PCBs. This study reports a fully additive manufacturing method called sequential build-up-covalent bonded metallization (SBUCBM) for the fabrication of miniaturized copper interconnects. Optical microscopy and scanning electron microscopy (SEM) imaging confirm the formation of robust copper interconnects with a feature size of L/S ≤ 5/5μm. Energy-dispersive x-ray spectroscopy (EDX) analysis demonstrates detailed information about selective copper metallization in the SBU-CBM method.
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