A Fully Additive Fabrication Approach for sub-10-Micrometer Microvia Suitable for 3-D System-in-Package Integration
Imani, Roghayeh; Chouhan, Shailesh; Putaala, Jussi; Nousiainen, Olli; Hagberg, Juha; Myllymäki, Sami; Acharya, Sarthak; Jantunen, Heli; Delsing, Jerker (2023-08-03)
IEEE
03.08.2023
R. Imani et al., "A Fully Additive Fabrication Approach for sub-10-Micrometer Microvia Suitable for 3-D System-in-Package Integration," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1926-1931, doi: 10.1109/ECTC51909.2023.00331
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© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
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Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:oulu-202401021032
https://urn.fi/URN:NBN:fi:oulu-202401021032
Tiivistelmä
Abstract
The semiconductor industry demands high input/output (I/O) density, requiring sub-l0-micrometer microvia. Here we propose a novel, fully additive, economical approach for creating and copper plating of microvias. The experimental process consisted of three stages. In Stage I, a polyurethane layer was spin-coated onto a FR-4 PCB base, followed by target copper layer deposition using the sequential build-up-covalent bonded metallization (SBU -CBM) method. In Stage II, first another layer of polyurethane was spin-coated on the top of the target copper layer, and then a microvia was created on the polyurethane layer using a picosecond pulsed ultraviolet (UV) laser. Finally, in Stage III, the SBU-CBM method was used to selectively copper plating of the microvia. Optical microscopy and cross-section scanning electron microscopy (SEM) images confirmed the successful formation and copper plating of sub-l0 micrometer microvia.
The semiconductor industry demands high input/output (I/O) density, requiring sub-l0-micrometer microvia. Here we propose a novel, fully additive, economical approach for creating and copper plating of microvias. The experimental process consisted of three stages. In Stage I, a polyurethane layer was spin-coated onto a FR-4 PCB base, followed by target copper layer deposition using the sequential build-up-covalent bonded metallization (SBU -CBM) method. In Stage II, first another layer of polyurethane was spin-coated on the top of the target copper layer, and then a microvia was created on the polyurethane layer using a picosecond pulsed ultraviolet (UV) laser. Finally, in Stage III, the SBU-CBM method was used to selectively copper plating of the microvia. Optical microscopy and cross-section scanning electron microscopy (SEM) images confirmed the successful formation and copper plating of sub-l0 micrometer microvia.
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