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Influence of elongation and washing on double-layer R2R-printed flexible electrodes for smart clothing applications

Sliz, Rafal; Huttunen, Olli-Heikki; Jansson, Elina; Kemppainen, Juhani; Schroderus, Jyrki; Kurkinen, Marika; Fabritius, Tapio (2020-09-01)

 
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https://doi.org/10.1109/NANO47656.2020.9183549

Sliz, Rafal
Huttunen, Olli-Heikki
Jansson, Elina
Kemppainen, Juhani
Schroderus, Jyrki
Kurkinen, Marika
Fabritius, Tapio
Institute of Electrical and Electronics Engineers
01.09.2020

R. Sliz et al., "Influence of elongation and washing on double-layer R2R-printed flexible electrodes for smart clothing applications," 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), Montreal, QC, Canada, 2020, pp. 282-287, doi: 10.1109/NANO47656.2020.9183549

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© 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
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doi:https://doi.org/10.1109/NANO47656.2020.9183549
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Abstract

Flexible electrodes are crucial for the growth of modern flexible electronics or smart clothing. Their ability to serve as sensing elements, deliver energy or transmit electrical signals in different conditions is essential for the evolution of wearables that will enrich our everyday life. In this study, we focus our efforts on understanding the impact of an additional protective layer on elongated and washed roll-to-roll printed (R2R) conductive flexible electrodes of various shapes. The electrical and morphological examinations provide information on the performance of the electrodes and materials during washing and elongation cycles. The acquired results indicate propitious electrode shapes as well as data concerning micro-scale cracking mechanisms, which are responsible for electrode performance degradation. The application of commercially available pastes and R2R printing methods allow the flawless utilization of the results and the fabrication of flexible and more reliable electronic components.

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