Non-contact characterization of flexible hybrid electronics by synchronized thermography

Remes, Kari; Fabritius, Tapio (2019-12-26)
 
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https://doi.org/10.1109/TIM.2019.2962576

Remes, Kari
Fabritius, Tapio
Institute of Electrical and Electronics Engineers
26.12.2019

K. Remes and T. Fabritius, "Non-Contact Characterization of Flexible Hybrid Electronics by Synchronized Thermography," in IEEE Transactions on Instrumentation and Measurement, vol. 69, no. 5, pp. 2390-2397, May 2020, doi: 10.1109/TIM.2019.2962576

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doi:https://doi.org/10.1109/TIM.2019.2962576
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https://urn.fi/URN:NBN:fi-fe202002195809
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Abstract

Eddy current heating with synchronized thermography (ST) is utilized for the contactless characterization of flexible hybrid electronics. A proposed approach is used for analyzing the uniformity of large area electronics being the basis for the quality assurance of hybrid electronics manufacturing. Flexible polymer substrate with printed conductors, bonded conventionally manufactured light-emitting diode (LED) chips and current regulators were used as test samples. Obtained results show that ST with eddy current heating is an effective and roll-to-roll compatible measurement tool for in-situ quality monitoring of hybrid electronics manufacturing.

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