Tape casting system for ULTCCs to fabricate multilayer and multimaterial 3D electronic packages with embedded electrodes
Chen, Mei‐Yu; Vahera, Timo; Hsi, Chi‐Shiung; Sobocinski, Maciej; Teirikangas, Merja; Peräntie, Jani; Juuti, Jari; Jantunen, Heli (2017-01-10)
Chen, MY, Vahera, T, Hsi, CS, et al. Tape casting system for ULTCCs to fabricate multilayer and multimaterial 3D electronic packages with embedded electrodes. J Am Ceram Soc. 2017; 100: 1257– 1260. doi:10.1111/jace.14639.
This is the peer reviewed version of the following article: Chen, MY, Vahera, T, Hsi, CS, et al. Tape casting system for ULTCCs to fabricate multilayer and multimaterial 3D electronic packages with embedded electrodes. J Am Ceram Soc. 2017; 100: 1257– 1260. doi:10.1111/jace.14639, which has been published in final form at https://doi.org/10.1111/jace.14639. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving.
https://rightsstatements.org/vocab/InC/1.0/
https://urn.fi/URN:NBN:fi-fe201903209378
Tiivistelmä
Abstract
A 3D multilayer structure built by two ultra‐low temperature co‐fired ceramic (ULTCC) compositions with silver embedded electrodes are co‐fired at a temperature of 450°C. The 3D multilayer module is prepared by laminating the ULTCC green tapes with a new binder system, which organics can be completely burned out at temperature of 250°C before the sintering of the ULTCC 3D modulus. High‐density microstructures are achieved for the sintered module. In this study, the ULTCC feasible binder system is introduced. Also, ULTCC multilayers and multimaterial structures with surface and embedded silver electrodes are fabricated. This research opens up a new horizon for fabrication of electroceramic devices with embedded electrodes in multimaterial devices.
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