Microelectronics, nanoelectronics : step behind the red brick wall using the thermal domain
Mizsei, J.; Lappalainen, J. (2019-03-06)
J. Mizsei, J. Lappalainen, Microelectronics, Nanoelectronics: step behind the red brick wall using the thermal domain, Materials Today: Proceedings, Volume 7, Part 3, 2019, Pages 888-893, ISSN 2214-7853, https://doi.org/10.1016/j.matpr.2018.12.089
© 2018 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
https://creativecommons.org/licenses/by-nc-nd/4.0/
https://urn.fi/URN:NBN:fi-fe2019101532713
Tiivistelmä
Abstract
The More-than-Moore Grand Challenge is a hot topic of present day solid state electronics: one way to step behind the “red brick wall” is the 3D heterogeneous integration of different systems with the conventional (standard) CMOS-technology. The aim of this study is to summarize the different bit representation methods, especially possibilities of our new, patented phonsistor (phonon transistor) based thermal-electronic logic system or thermal-electronic logic circuit (TELC). TELC is the first logic gate approach using two different physical quantities, i.e. electrical and thermal for bit representation within one system.
Kokoelmat
- Avoin saatavuus [36528]
